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Job Description is for the position of Technical Splst in the Area of Hardware
Enclosure development for Avionics.
The candidate should be able to Execute Mechanical Engineering design and FE
Analysis work for Electronics packaging.
in-depth knowledge in use of CAE tools like Ansys and NX Analysis.
the ability to Perform FE Analysis (Thermal and Structural Analysis) in any of
the Analysis Tools independently.
in-depth knowledge in use of MCAD tools like Pro-E / NX/ AutoCAD.
Demonstrate the ability to understand the SOW for the project assigned to.
Convert the requirements defined in the SOW to Tasks and execute on the same.
Demonstrates ability to develop conceptual designs for Avionics Hardware and
Electronic Test Benches with no supervision in any of the MCAD applications.
Preferable for the candidate to have exposure to manufacturing and assembly and
exposure to NPI workflow process.
Bachelor’s or Masters in Mechanical Engineering from reputed University.
Should have 8-14 years of working experience in Enclosure design and executing FE Analysis.Additional Information
Location:Devarabisanahalli Village, KR Varturhobli,, East Taluk - Phase I, Bangalore, KARNATAKA 560103 IND
Celebrating 100 Years In Aviation
Honeywell is an equal opportunity employer. Qualified applicants will be considered without regard to age, race, creed, color, national origin, ancestry, marital status, affectional or sexual orientation, gender identity or expression, disability, nationality, sex, religion, or veteran status.